Die loss estimation using universal in-line metric (UILM)

Details Die loss estimation using universal in-line metric (UILM) Die loss estimation using universal in-line metric (UILM)

2006-03-10

2009-02-03

Pham, Thanh V (Department: 2894)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S033000, C438S068000, C438S110000, C438S113000, C438S114000, C438S458000, C438S461000, C438S462000, C438S463000

Reexamination Certificate

active

07485548

ABSTRACT:
A system predicts die loss for a semiconductor wafer by using a method referred to as universal in-line metric (UILM). A wafer inspection tool detects defects on the wafer and identifies the defects by various defect types. The UILM method applies to various ways of classification of the defect types and takes into account the impact of each defect type on the die loss.

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