Communications: electrical – Condition responsive indicating system – Specific condition
Reexamination Certificate
2006-09-05
2006-09-05
Trieu, Van T. (Department: 2636)
Communications: electrical
Condition responsive indicating system
Specific condition
C340S572100, C257S447000, C257S787000, C029S458000, C029S825000
Reexamination Certificate
active
07102524
ABSTRACT:
A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. A ring shaped groove is formed in a first surface of a wafer around a plurality of dies. The wafer is scribed to form a grid of grooves in the first surface of the wafer that separates the plurality of dies. A solidifiable material is applied to the first surface of the wafer to substantially fill the ring shaped groove and the grooves of the grid. The solidifiable material is caused to harden into a ring shaped hardened material in the ring shaped groove and into a grid shaped hardened material in the grooves of the grid. The wafer is thinned so that the grid shaped hardened material removably holds the plurality of dies.
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Copy of International Search Report for Application No. PCT/US03/23792, mailed Jan. 12, 2004 (4 pages).
Arneson Michael R.
Bandy William R.
Sterne Kessler Goldstein & Fox P.L.L.C.
Symbol Technologies Inc.
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