Die for molding disk substrate and method of manufacturing...

Details Die for molding disk substrate and method of manufacturing... Die for molding disk substrate and method of manufacturing...

2007-12-25

2007-12-25

Gupta, Yogendra N. (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Female mold and charger to supply fluent stock under...

C425S810000, C264S001330, C264S106000, C264S107000, C264S328100

Reexamination Certificate

active

10547552

ABSTRACT:
A die for molding a disk substrate capable of forming fine recessed and projected pits and grooves up to the outer periphery of the disk substrate by preventing low heat conductive elements from peeling off and burrs from occurring on the outer periphery thereof. The die includes a first base die, a second base die disposed oppositely to the first base die, a first low heat conductive element fixed to the first base die, a stamper fixed onto the first low heat conductive element, a second low heat conductive element fixed onto the second base die, and a ring-like regulating member fitted to and in slidable contact with either of the first and second low heat conductive elements. The die is characterized in that the end part of the ring-shaped regulating member is positioned within the range of the outer peripheral side face of the low heat conductive element in slidable contact therewith.

REFERENCES:
patent: 5683630 (1997-11-01), Inoue
patent: 6099287 (2000-08-01), Higashida et al.
patent: 6142761 (2000-11-01), Arakawa et al.
patent: 6517339 (2003-02-01), Miya et al.
patent: 5-73720 (1993-10-01), None
patent: 8-66945 (1996-03-01), None
patent: 11-48291 (1999-02-01), None
patent: 2001-310358 (2001-11-01), None
patent: 2001-334534 (2001-12-01), None
patent: 2003-19717 (2003-01-01), None
English abstract and computer translation for JP 2003-19717.

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