Die for forming an optical element, and production method as...

Details Die for forming an optical element, and production method as... Die for forming an optical element, and production method as...

2007-12-04

2007-12-04

Dickey, Thomas L. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Ball or nail head type contact, lead, or bond

C257S781000, C428S901000

Reexamination Certificate

active

11134954

ABSTRACT:
A die for forming an optical element, comprising:(i) a base member having a base surface which comprises a foundation area including a die surface to form an optical surface of the optical element and a peripheral area provided around the foundation area; (ii) a first layer covering both of the foundation area and the peripheral area and removable by being dissolved in a processing solution; and (iii) a second layer covering a part of the first layer corresponding in position to the foundation area so that a remaining part of the first layer corresponding in position to the peripheral area is not covered by the second layer.

REFERENCES:
patent: 2003/0196903 (2003-10-01), Teshima et al.
patent: 01-192733 (1989-08-01), None
patent: 05-032424 (1993-02-01), None

Affiliated with

Also associated with

Rating

Die for forming an optical element, and production method as... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die for forming an optical element, and production method as..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die for forming an optical element, and production method as... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3834620