Die encapsulation using a porous carrier

Details Die encapsulation using a porous carrier Die encapsulation using a porous carrier

2006-03-21

2006-03-21

Guerrero, Maria F. (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Encapsulating

C438S106000, C438S112000, C438S118000

Reexamination Certificate

active

07015075

ABSTRACT:
A process for encapsulating an integrated circuit die (403) using a porous carrier (101). In one example, an adhesive structure (e.g. tape) is applied to a porous carrier. Integrated circuit die is then placed on the adhesive structure. The integrated circuit die is then encapsulated to form an encapsulated structure (505). The carrier is then subjected to a solvent that passes through the carrier to reduce the adhesive strength of the adhesive structure for removal of the carrier from the encapsulated structure.

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patent: 2002-362677 (2002-12-01), None
patent: WO 02/33751 (2002-04-01), None
JP 2002-362677 A, Dec. 2002, Takaoka et al., Translation.

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