Die eject system for die bonder

Details Die eject system for die bonder Die eject system for die bonder

1992-06-18

1992-11-24

Dayoan, D. Glenn

Conveyors: power-driven

Conveyor system for moving a specific load as a separate unit

System includes a rotating or endless carrier with a load...

1984821, 1983452, B65G 2900

Patent

active

051655217

ABSTRACT:
A die eject system for a hybrid die bonder, in particular an automatic hybrid die bonder, comprises a support, on which a plurality of die eject heads are mounted. The die eject heads can be sequentially indexed into an operative position. The system has the advantage that it is possible to change rapidly from one head to another, either to eject different sizes of dice or in the case of damage to a die eject needle within a die eject head.

REFERENCES:
patent: 1344653 (1920-06-01), Rosengren
patent: 2956664 (1960-10-01), Brown et al.
patent: 2962153 (1960-11-01), Brodbeck
patent: 3037269 (1962-06-01), Barkstrom et al.
patent: 3308921 (1967-03-01), Bower
patent: 3378129 (1968-04-01), Mancacci
patent: 4158405 (1979-06-01), Jackson
patent: 4358920 (1982-11-01), Kanai et al.

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