Die design with integrated assembly aid

Details Die design with integrated assembly aid Die design with integrated assembly aid

2007-10-16

2007-10-16

Tang, Minh N. (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

C324S754090, C324S761010

Reexamination Certificate

active

10987039

ABSTRACT:
An upper die portion (36) of a die head for aligning probe pins (14) in first array of first micro-holes (18) formed in lower die portion (12) of the die head, which generally includes a spacer portion (38), a support frame (40), and first and second assembly aid films (42) and (44), respectively. Spacer portion (38) is adapted to contact lower die portion (12). First assembly aid film (42) is typically positioned between second surface (48) and support frame (40) and includes a second array of second micro-holes (50) adapted to receive probe pins (14). Second assembly aid film (44) generally is in contact or close proximity to first assembly aid film (42) and has a third array of third micro-holes (52) adapted to receive probe pins (14). Second array of second micro-holes (50) and third array of third micro-holes (52) are patterned to align with one another but are both offset with first array of first micro-holes (18) by approximately the lateral distance between probe tip (20) and probe head (28).

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