Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate
2006-01-31
2006-01-31
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
Reexamination Certificate
active
06992399
ABSTRACT:
An apparatus in one example includes a die with at least first and second portions, the first portion of the die mechanically and electrically connectable with a circuit board. The apparatus includes an integrated circuit component mechanically and electrically connected with the second portion of the die. Upon operation the die serves to generate one or more electrical signals that are passed to the integrated circuit component.
REFERENCES:
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5172050 (1992-12-01), Swapp
patent: 5465611 (1995-11-01), Ruf et al.
patent: 5475318 (1995-12-01), Marcus et al.
patent: 5723894 (1998-03-01), Ueno et al.
patent: 6052287 (2000-04-01), Palmer et al.
patent: 6072700 (2000-06-01), Nam
patent: 6105427 (2000-08-01), Stewart et al.
patent: 6441315 (2002-08-01), Eldridge et al.
patent: 6465747 (2002-10-01), DiStefano et al.
patent: 6520778 (2003-02-01), Eldridge et al.
patent: 6565392 (2003-05-01), Padro
patent: 6651325 (2003-11-01), Lee et al.
patent: 6791176 (2004-09-01), Mathieu et al.
patent: 2002/0055282 (2002-05-01), Eldridge et al.
“MEMS”; http://www.techweb.com/encyclopedia/defineterm?term=MEMS&×=23&y=12; TechEncyclopedia; Computer Language Company, 5521 State Park Road, Point Pleasant, PA 18950; 1 pg.; May 20, 2002.
“die”; http://www.techweb.com/encyclopedia/defineterm?term=die; TechEncyclopedia; Computer Language Company, 5521 State Park Road, Point Pleasant, PA 18950; 1 pg.; May 24, 2002.
“Compliant”; http://www.dictionary.com/search?q=compliant; Lexico, LLC; Lexico, LLC, 13428 Maxella Avenue #236, Marina del Rey, CA 90292; 2 pgs.; May 24, 2002.
“Stress”; http://www.dictionary.com/search?q=stress; Lexico, LLC; Lexico, LLC, 13428 Maxella Avenue #236, Marina del Rey, CA 90292; 6 pgs.; May 24, 2002.
“flip chip technology”; http://www.seminiconductorglossary.com/default.asp?searchterm=flip+chip+technology; 1 pg.; May 20, 2002.
“Backplane”; http://www.maximon.com/eb.htm; LLH Technology Publishing, Eagle Rock, VA USA; 1 pg.; May 20, 2002.
Northrop Grumman Corporation
Patti & Brill LLC
Zarneke David A.
LandOfFree
Die connected with integrated circuit component for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Die connected with integrated circuit component for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die connected with integrated circuit component for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3553819