Plastic and nonmetallic article shaping or treating: processes – With measuring – testing – or inspecting – Positioning of a mold part to form a cavity or controlling...
Reexamination Certificate
2011-01-11
2011-01-11
Heitbrink, Jill L (Department: 1791)
Plastic and nonmetallic article shaping or treating: processes
With measuring, testing, or inspecting
Positioning of a mold part to form a cavity or controlling...
Reexamination Certificate
active
07867415
ABSTRACT:
Used in a method of this invention is a die clamping unit, which comprises a tie bar movably attached to a stationary platen, a halfnut positioning servomotor which advances and retreats to the tie bar, a halfnut which is provided on a movable platen and fixes the movable platen and the tie bar together by engaging the tie bar, an engaging mechanism which engages the halfnut with the tie bar, a hydraulic die clamping cylinder which presses the stationary platen and the movable platen, and a control device which controls the halfnut positioning servomotor and the hydraulic cylinder. The control device drives the halfnut positioning servomotor to remove a clearance between the halfnut and an engaging groove of the tie bar before a die clamping process carried out by the hydraulic cylinder.
REFERENCES:
patent: 4948358 (1990-08-01), Kushibe et al.
patent: 4984980 (1991-01-01), Ueno
patent: 5135385 (1992-08-01), Fukuzawa et al.
patent: 5249951 (1993-10-01), Leonhartsberger et al.
patent: 5297952 (1994-03-01), Leonhartsberger et al.
patent: 5556656 (1996-09-01), Lampl et al.
patent: 5863474 (1999-01-01), Ito et al.
patent: 6050804 (2000-04-01), Tamaki et al.
patent: 6599117 (2003-07-01), Kasal et al.
patent: 6655949 (2003-12-01), Chikazawa et al.
patent: 6821104 (2004-11-01), Kubota et al.
patent: 6843647 (2005-01-01), Fujita et al.
patent: 6877977 (2005-04-01), Wohlrab
patent: 6932924 (2005-08-01), Nishizawa et al.
patent: 7168946 (2007-01-01), Koike et al.
patent: 7416403 (2008-08-01), Koike et al.
patent: 7566214 (2009-07-01), Koike et al.
patent: 2002/0180132 (2002-12-01), Kubota et al.
patent: 2003/0189267 (2003-10-01), Nishizawa et al.
patent: 396903 (1993-12-01), None
patent: 10103983 (2002-04-01), None
patent: 10202374 (2003-07-01), None
patent: 10316199 (2003-10-01), None
patent: 764509 (1997-03-01), None
patent: 1378335 (2004-01-01), None
patent: 2-241715 (1990-09-01), None
patent: 4-38936 (1992-02-01), None
patent: 6-182838 (1994-07-01), None
patent: 10-296739 (1998-11-01), None
patent: 2002-127216 (2002-05-01), None
patent: 2002-154146 (2002-05-01), None
patent: 2002-225101 (2002-08-01), None
patent: 2002-327826 (2002-11-01), None
patent: 2003-71894 (2003-03-01), None
patent: 2003-181894 (2003-07-01), None
patent: 2003-266503 (2003-09-01), None
patent: 2003-340827 (2003-12-01), None
patent: 2004-1470 (2004-01-01), None
patent: 200498582 (2004-04-01), None
patent: 2004-314491 (2004-11-01), None
patent: 2004-330449 (2004-11-01), None
patent: 2004314492 (2004-11-01), None
Office Action issued in U.S. Appl. No. 11/043,936 mailed Sep. 9, 2008.
Notice of Allowance issued in U.S. Appl. No. 11/043,936 mailed Mar. 20, 2009.
English Translation of German Office Action issued in DE Application 10 2005 004 135.3-51 on Apr. 26, 2006.
English Language Abstract of JP Publication 2003-181894 published Jul. 2, 2003.
Machine Translation of JP Publication 2003-181894 published Jul. 2, 2003.
English Language Abstract of JP 2004-1470 published Jan. 8, 2004.
Machine Translation of JP 2004-1470 published Jan. 8, 2004.
English Language Abstract of JP 2003-340827 published Feb. 12, 2003.
Machine Translation of JP 2003-340827 published Feb. 12, 2003.
Office Action issued in JP Appl 2005-011682 on Mar. 30, 2010.
English Language Translation of Office Action issued in JP Appl 2005-011682 on Mar. 30, 2010.
Non-Final Office Action; U.S. Appl. No. 11/401,460 mailed Jan. 9, 2008.
Office Action issued in U.S. Appl. No. 11/043,937 mailed Jun. 15, 2006.
English Language Abstract of JP 2002-154146 published May 28, 2002.
English Language Abstract of JP 2002-225101 published Aug. 14, 2002.
English Language Abstract of JP 2002-327826 published Nov. 15, 2002.
English Language Abstract of JP 2003-71894 published Mar. 12, 2003.
English Language Abstract of JP 2003-266503 published Sep. 24, 2003.
English Language Abstract of JP 2004-330449 published Nov. 25, 2004.
English Language machine translation of JP 2002-154146 published May 28, 2002.
English Language machine translation of JP 2002-225101 published Aug. 14, 2002.
English Language machine translation of JP 2002-327826 published Nov. 15, 2002.
English Language machine translation JP 2003-71894 published Mar. 12, 2003.
English Language machine translation of JP 2003-266503 published Sep. 24, 2003.
English Language machine translation of JP 2004-330449 published Nov. 25, 2004.
English Language Abstract of JP 2004-314492 published Nov. 11, 2004.
English Language Abstract of JP 2004-98582 published Apr. 2, 2004.
English Language machine translation of JP 2004-314492 published Nov. 11, 2004.
English Language machine translation of JP 2004-98582 published Apr. 2, 2004.
Office Action issued (in German) in EP Appl 10 2006 017 502 on Jun. 18, 2007.
English Language Translation of Office Action issued in EP Appl 10 2006 017 502 on Jun. 18, 2007.
English Language Translation of EP Publication 0764509 published Mar. 26, 1997.
English Language Abstract for JP 4-38936 published Feb. 10, 1992.
English Language Abstract for JP 2-241715 published Sep. 26, 1990.
Koike Jun
Matsubayashi Haruyuki
Miyauchi Takaki
Muroi Nobuyuki
Nishizawa Makoto
DLA Piper (LLP) US
Heitbrink Jill L
Toshiba Kikai Kabushiki Kaisha
LandOfFree
Die clamping method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Die clamping method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die clamping method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2725168