Die carrier

Details Die carrier Die carrier

Filed on

2005-02-22

Date issued

2005-02-22

Examiner

Tang, Minh N. (Department: 2829)

Patent Class

Electricity: measuring and testing

SubClass

Fault detecting in electric circuits and of electric components

SubSubClass

Of individual circuit component or element

Other Related Categories

C324S765010

Type

Reexamination Certificate

Status

active

Patent number

06859057

Description

ABSTRACT:
A die carrier is disclosed which is specifically designed for use in a TSOP socket. More specifically, the die carrier has a carrier substrate with carrier contacts thereon that are dimensioned specifically to match the positioning of the upper and lower socket contacts. The carrier substrate, being 145 microns thick, can also fit between the upper and lower socket contacts. A carrier base support component is located below a portion only of the carrier substrate, and does not impair insertion of the carrier substrate into the relatively small spacing between the upper and lower socket contacts. Damage to the carrier substrate is avoided by clamping edges of the carrier substrate from opposing sides between the upper and lower socket contacts. There are no screws or nuts within the carrier base support component that may increase its size and prevent it from being inserted into the socket.

REFERENCES:
patent: 5517125 (1996-05-01), Posedel et al.
patent: 5519332 (1996-05-01), Wood et al.
patent: 5705933 (1998-01-01), Lim et al.
patent: 5731709 (1998-03-01), Pastore et al.
patent: 6025732 (2000-02-01), Foo et al.
patent: 6072326 (2000-06-01), Akram et al.

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