Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1988-01-19
1989-10-17
Simmons, David
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
118679, 118682, 156356, 222 61, 222399, 222639, 222642, B65D 8314
Patent
active
048744441
ABSTRACT:
This die-bonding method relates to an improvement in a method to apply high pressure air to a resin vessel under a predetermined discharge condition to discharge the resin onto a portion subject to bonding, thus to adhesively join or connect a semiconductor chip to the portion subject to bonding by the resin discharged. This method includes a process for detecting a pressure waveform applied to the resin vessel, and a process for controlling the discharge condition to compensate the difference between the pressure waveform detected and a predetermined reference pressure waveform so that a predetermined resin quantity is discharged at all times even when the quantity of resin within the resin vessel varies. There is also provided an apparatus for implementing this die-bonding method, which includes a correction circuit for performing the above compensating operation.
REFERENCES:
patent: 3347418 (1967-10-01), Fefferman
patent: 3499580 (1970-03-01), Smith
patent: 3666143 (1972-05-01), Weston
patent: 4164001 (1979-08-01), Patnaude
patent: 4334636 (1982-06-01), Paul
patent: 4675301 (1989-06-01), Charneski et al.
(Relevant Catalogue), "Automatic System Dispenser" catalogue, Iwashita Engineering, Inc., 1986/2.
(Relevant Catalogue), Toray "Pro-Hi-Dispenser Pad-1000 Series" catalogue, Toray Engineering Kabushiki Kaisha (No publication date).
(Relevant Document), "Automated Technology", vol. 12, No. 7, Jul. '86, Title "Guide to Practical Technology", (pp. 94-96) Taiji Sugihara, Kato Giko Ltd.
Satou Takeo
Shimizu Yasuhiko
Kabushiki Kaisha Toshiba
Simmons David
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