Die bonding method

Details Die bonding method Die bonding method

1988-12-28

1990-02-27

Ball, Michael W.

Coating processes

Coating remains adhesive or is intended to be made adhesive

156356, 156578, 29740, 118410, 118706, 222 52, 222 61, B32B 3100

Patent

active

049044990

ABSTRACT:
A die bonding method using an adhesive agent for fixedly mounting a semiconductor chip on a substrate of a lead frame, wherein a needle for discharging adhesive agent is moved near the substrate to apply the adhesive agent onto the substrate, and thereafter, the needle and substrate are initially moved apart at a first velocity and then at a second velocity greater than the first velocity.

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