Die-bonding machine

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Plural discrete workpieces

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228 45, 228 491, 228 565, B23K 304, B23K 306, B23K 1002, B23K 1005, B23K 1008

Patent

active

061490474

ABSTRACT:
In a die-bonding machine for picking up a number of semiconductor pellets arranged in the form of a pellet array, one by one, to place a picked-up semiconductor pellet on a predetermined position, when an estimated X-direction coordinate position of the semiconductor pellet to be picked up in relation to the pellet supporting and displacing mechanism is assumed as being "x" by considering a center point of the pellet supporting and displacing mechanism as the origin of the coordinates in the X direction, the pellet supporting and displacing mechanism and the pellet picking-up and carrying mechanism are displaced so that an X-direction coordinate position PX of the pick-up position takes a position expressed by the following equation (1) and an X-direction coordinate position CX of the center point of the pellet supporting and displacing mechanism takes a position expressed by the following equation (2):

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