Die-bonding electroconductive paste

Details Die-bonding electroconductive paste Die-bonding electroconductive paste

1984-12-05

1986-03-04

Lieberman, Paul

Compositions

Electrically conductive or emissive compositions

Free metal containing

252500, 252503, 252506, 252511, 252512, 252515, 252518, 428418, 428688, 428699, 428704, 428901, H01B 116

Patent

active

045740569

ABSTRACT:
A die-bonding electroconductive paste containing at least one element having the same valence as the valence of a semiconductor element to be die-bonded or a compound of said element and a reducing substance and permitting ohmic contact to be effected at a temperature of not less than 100.degree. C.

REFERENCES:
patent: 3925698 (1975-12-01), Stahl
patent: 4293451 (1981-10-01), Ross
patent: 4317856 (1982-03-01), Huthwelker et al.

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Also associated with

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