Die-bonding device

Details Die-bonding device Die-bonding device

1997-05-01

1999-03-02

Engel, James

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

29831, 414752, B32B 3100

Patent

active

058765565

ABSTRACT:
Head part carrying a nozzle for picking-up a chip is moved up and down with the use of a can and cam follower during movement of the head part between a wafer in a chip supply part and a substrate in a positioning part so as to shorten a stroke for the up and down movement of the nozzle for picking up a chip from a wafer in the chip supply part, and mounting the chip on the substrate, and a load during the movement of the nozzle is reduced thereby it is possible to enhance the speed at which the head part is moved between the wafer and the substrate so as to shorten the time tact and to enhance the working efficiency.

REFERENCES:
patent: 3762015 (1973-10-01), Radobenko
patent: 4346514 (1982-08-01), Makizawa et al.
patent: 4763941 (1988-08-01), Sniderman
patent: 4960485 (1990-10-01), Ichinose et al.

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