Die bonding connector and method

Details Die bonding connector and method Die bonding connector and method

1993-11-08

1995-06-20

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174261, 174262, 361760, 361774, 361777, H05K 100

Patent

active

054262666

ABSTRACT:
A connection for mounting an IC die directly to a substrate includes circuit runs deposited on the substrate with bond pad portions having metallization patterns forming ridges and cutout areas. Metal bumps made of gold or other highly conductive malleable material are placed atop the metallization patterns and are forced into the cutout areas between ridges as the dies are compressed onto the substrate. This locks the dies to the circuit run bond pads so as to resist thermal stress and high humidity.

REFERENCES:
patent: 5307559 (1994-05-01), Long

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