Die bonding apparatus and method of controlling the same

Details Die bonding apparatus and method of controlling the same Die bonding apparatus and method of controlling the same

1991-09-20

1993-09-21

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156358, B32B 3100

Patent

active

052465136

ABSTRACT:
A die bonding apparatus includes a Z-axis direction drive mechanism having a main drive motor, a bonding arm having a first arm and a second arm, a holding device provided on one end of the second arm for releasably holding a die, a torque generating device for applying a torque to the second arm, a parallel position detecting device for detecting a displacement of the second arm from a state in which the die and the bonding surface are parallel to each other and for generating a displacement signal, and a control device for storing an inclination of the bonding surface beforehand and for controlling the descent of the second arm and the application of a load to the die.

REFERENCES:
patent: 4909869 (1990-03-01), Sakamoto et al.
patent: 4913763 (1990-04-01), Yamazaki et al.
patent: 5080736 (1992-01-01), Matsui

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