Die bonding apparatus

Details Die bonding apparatus Die bonding apparatus

1998-07-22

2000-08-15

Ryan, Patrick

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Gaseous flux

228102, 228 62, B23K 100, B23K 500, B23K 2014

Patent

active

06102273&

ABSTRACT:
In a die bonding apparatus, above a work placing table shrouded in the atmosphere of an inert gas, there are provided a pair of gas injecting heads which can be separated from each other to enlarge the opening to the degree that the largest semiconductor package can be inserted through the opening and which can reduce the opening to the degree that a bonding head can be inserted through the opening. The pair of gas injecting heads form at least two layers of gas curtain by injecting an inert gas from the inner wall of the opening, so that the inert gas atmosphere is ensured within a space, so as to maintain the oxygen concentration at a low level thereby to prevent generation of an oxide film. Thus, the oxide film is prevented from generating at a surface of a bonding agent when the bonding agent is molten at the time of a die bonding.

REFERENCES:
patent: 4974754 (1990-12-01), Wirz
patent: 4984731 (1991-01-01), Imamura
patent: 4987673 (1991-01-01), Kogura et al.
patent: 5115545 (1992-05-01), Fujimoto et al.
patent: 5232143 (1993-08-01), Buxton
patent: 5749510 (1998-05-01), Eifuku
patent: 5899341 (1999-05-01), Irita

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