Die bonding apparatus

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Including compliant cushioning medium

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Details

228 447, B23K 2002

Patent

active

047687029

ABSTRACT:
As a die bonding apparatus for establishing electrical connection between electrodes on one side of a semiconductor chip and associated electrodes on a package comprises a pair of pinching and pressing mechanisms having a pair of pinching and pressing surfaces adapted to be moved closer relative to each other and so as to pinch and press semiconductor chip and package and at least one remote center mechanism provided in at least one of the pair of pinching and pressing mechanisms, in such a manner that a remote center thereof is positioned in the pinching and pressing surface of above-mentioned one pinching and pressing mechanism, for adjusting orientations of the pair of pinching and pressing surfaces to make the orientations thereof correspond to those of both surfaces of the semiconductor chip and the package at the time of the pressing and pinching operation all of the electrodes on one side of the semiconductor chip are thereby uniformly pressed against the corresponding electrodes on the package without any laterally shifting movement thereof even if the chip is inclined relative to the package because the sizes of bumps of the electrodes on the chip are not constant.

REFERENCES:
patent: 3574923 (1971-04-01), Cushman
patent: 3608809 (1971-09-01), Cushman
patent: 3790738 (1974-02-01), Laub et al.
patent: 4638937 (1987-01-01), Belanger

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