Die bonding apparatus

Details Die bonding apparatus Die bonding apparatus

1988-12-22

1990-04-03

Wityshyn, Michael

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

Automatic and/or material-triggered control

100 50, 100256, 100257, 156497, 156580, B03B 1520, B03B 1522

Patent

active

049137638

ABSTRACT:
A die bonding apparatus including a vertically moving block, a collet holder provided on the vertically moving block such that the collet holder itself freely moves up and down, a collet which holds a die to be bonded to a substrate and is installed in the collet holder, a first contact provided on the vertically moving block, and a second contact provided on the collet holder so that the second contact is pressed by a spring to make contact with the upper surface of the first contact. The position where rapid downward movement of the collet is stopped and the bonding load applied to the substrate are decided based upon a signal which is generated upon separation of the two contacts.

REFERENCES:
patent: 1563684 (1925-12-01), Black
patent: 3041963 (1962-07-01), Hazelton et al.
patent: 3841140 (1974-10-01), Hryc
patent: 4640732 (1987-02-01), Stafford
patent: 4725327 (1988-02-01), Matuda et al.
patent: 4749435 (1988-06-01), Kogane et al.

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