Die bonding apparatus

Details Die bonding apparatus Die bonding apparatus

1992-04-02

1993-03-30

Seidel, Richard K.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Plural discrete workpieces

228 7, 228103, B23K 3112

Patent

active

051976501

ABSTRACT:
A die bonding apparatus includes a device for making a coarse surface in a region where an identifier is to be applied to a lead frame; an application device for applying the identifier to the coarse surface region, a dividing device for dividing a wafer into chips, a test device for testing the wafer which has not been divided into chips yet in positions corresponding to the prospective chips, a storage device for storing information about positions of the chips on the wafer and the test results, a die bonding device picking out the chips from the wafer for die-bonding them to the lead frame having the identifier, a reading device for reading the identifier of the lead frame to which the chips are to be die-bonded, an information processing device for adding information which the identifier contains to the test results and position information about each of the chips to make test information, and an output device for outputting the test information.

REFERENCES:
patent: 2034308 (1936-03-01), Morgan
patent: 3044202 (1962-07-01), Lindmark
patent: 4585931 (1986-04-01), Duncan et al.
patent: 4809342 (1989-02-01), Kappner
patent: 4913335 (1990-04-01), Yoshida
"Specifications: Innerlead Bonder Model 1325", Kulicke & Soffa Industries, Inc., 1975.

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