Die bonder with electrically driven scrubbing means

Details Die bonder with electrically driven scrubbing means Die bonder with electrically driven scrubbing means

1985-09-30

1986-09-30

Godici, Nicholas P.

Metal fusion bonding

Means to apply vibratory solid-state bonding energy to work

228 31, 228 61, 310 15, B23K 106

Patent

active

046142924

ABSTRACT:
A die bonder for bonding a semiconductor die to a substrate is disclosed. The die bonder comprises a support assembly within a frame, which assembly supports an arm. Attached to said arm is a means for holding a die, e.g. a vacuum collet. A variable electrical scrubbing means comprises a plunger which oscillates reciprocally within an electromagnetic coil and contacts the arm, or a tab integral with said arm. This provides a corresponding uniform scrubbing action, perpendicular to said arm in the plane of the interface between the die and the substrate, between a die held by the holding means and a solder material interposed between the die and substrate.

REFERENCES:
patent: 3302277 (1967-02-01), Pruden et al.
patent: 3451607 (1969-06-01), Miller et al.
patent: 3790738 (1974-02-01), Laub et al.
patent: 3822465 (1974-07-01), Frankort et al.

Affiliated with

Also associated with

Rating

Die bonder with electrically driven scrubbing means does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die bonder with electrically driven scrubbing means, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die bonder with electrically driven scrubbing means will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-980216