Die bonder for a semiconductor producing apparatus

Details Die bonder for a semiconductor producing apparatus Die bonder for a semiconductor producing apparatus

1997-02-18

2000-07-11

Graybill, David E.

Metal working

Barrier layer or semiconductor device making

29740, H01L 2100, H01L 2164

Patent

active

060866411

ABSTRACT:
A die bonder for a semiconductor producing apparatus is disclosed. The die bonder is capable of dealing with packages having a standard structure and packages having an LOC (Lead On Chip) structure, as needed.

REFERENCES:
patent: 3668044 (1972-06-01), Wiesler et al.
patent: 5009590 (1991-04-01), Mitarai et al.
Technical Report of Hitachi Tokyo Electronics Co., Ltd., No. 12, pp. 20-21, date not avail.
Technical Report of Hitachi Tokyo Electronics Co., Ltd., No. 7, pp. 12-16, date not avail.
Catalog No. LM100 92-01 of Hitachi Tokyo Electronics Co., Ltd. (2 pp.), date not avail.
"LOC Assembly Techniques and Apparatus Outline"; Hitachi Tokyo Electronics Co., Ltd., (20 pp.), date not avail.
Japanese Office Action dated May 19, 1998 with English language translation of Japanese Examiner's comments.

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