Die-attaching paste and semiconductor device

Details Die-attaching paste and semiconductor device Die-attaching paste and semiconductor device

2005-03-01

2005-03-01

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

C252S503000, C252S510000, C252S518100, C257S783000

Reexamination Certificate

active

06861013

ABSTRACT:
The present invention provides a die-attaching paste superior in solder cracking resistance, used for bonding of semiconductor chips. The present invention lies in a die-attaching paste comprising as essential components:(A) a hydrocarbon having a number-average molecular weight of 500 to 5,000 and at least one double bond in the molecule, or its derivative,(B) a reactive diluent,(C) a radical polymerization catalyst, and(D) a filler.

REFERENCES:
patent: 11-228928 (1998-02-01), None
patent: 11228928 (1999-08-01), None
patent: 11-269452 (1999-10-01), None
patent: 2000-104035 (2000-04-01), None
patent: 2000-234043 (2000-08-01), None
patent: 2001-207033 (2001-07-01), None
International Search Report, dated Jul. 24, 2001, for PCT Application No. PCT/JP01/03040, 4 pps.

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