Die attach using gold ribbon with gold/silicon eutectic alloy cl

Details Die attach using gold ribbon with gold/silicon eutectic alloy cl Die attach using gold ribbon with gold/silicon eutectic alloy cl

1989-05-12

1991-08-06

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

228123, 22826312, 357 71, 148DIG62, 148DIG12, H01L 21603

Patent

active

050377787

ABSTRACT:
An improved method for eutectically bonding a silicon wafer into a cavity of a packaging body. A gold/silicon eutectic alloy cladding is formed on a ribbon made of gold. A strip is cut from the ribbon and placed into the package cavity with the cladding side up. Then a die is placed onto the strip on top of the gold/silicon cladding. The die is then scrubbed at a temperature of approximately 400.degree. C. and the gold/silicon cladding acts as a catalyst to form a gold/silicon eutectic bond between the die and the packaging body.

REFERENCES:
patent: 3316628 (1967-05-01), Lang
patent: 3585711 (1968-09-01), Hicks
patent: 3593412 (1971-07-01), Foote
patent: 3729807 (1973-05-01), Fujiwara
patent: 4771018 (1988-09-01), Bhattacharyya et al.
patent: 4810671 (1989-03-01), Bhattacharyya et al.

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