Die attach structure and method

Details Die attach structure and method Die attach structure and method

1990-12-14

1992-09-22

Larkins, William D.

357 81, H01L 3902, H01L 2302

Patent

active

051501970

ABSTRACT:
Die attach structure and method in which the joint between a die and a substrate is formed in a manner which provides a uniform temperature distribution in the die and reduces stress in the joint near the edge of the die. In some embodiments, the substrate is formed with a non-planar surface in the die attach area, and the joint between the die and the substrate is thicker toward the edge of die than at the center. In other embodiments, different die attach materials are employed to make the joint stiffer toward the center of the die and more flexible toward the edges. In some embodiments, both the thickened joint and the different die attach materials are employed.

REFERENCES:
patent: 3532944 (1970-10-01), Ollendorf et al.
patent: 3821614 (1974-04-01), Schmidt
patent: 4151546 (1979-04-01), Kawagai et al.
patent: 4258382 (1981-04-01), Harris
patent: 4263606 (1981-05-01), Yorikane
patent: 4413308 (1983-11-01), Brown
patent: 4434434 (1984-02-01), Bhattacharya et al.
patent: 4446912 (1984-05-01), Diehl et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4649415 (1987-03-01), Hebert
patent: 4670770 (1987-06-01), Tai
patent: 4757934 (1988-07-01), Greenstein
patent: 4903118 (1990-02-01), Iwade
Webster's Dictionary pg. 364 .COPYRGT.1984.
IBM Technical Disclosure Bulletin "Microelectronic Devices Standoffs" by Miller vol. 8 No. 3 Aug. 1965.
IBM Technical Disclosure Bulletin vol. 28, No. 6 Nov. 1985, p. 2353 "Solder Pad Improvement".

Affiliated with

Also associated with

Rating

Die attach structure and method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die attach structure and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die attach structure and method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1073349