Die attach method and integrated circuit device

Details Die attach method and integrated circuit device Die attach method and integrated circuit device

1998-02-19

1999-05-18

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, 438121, H01L21/44;21/48;21/50

Patent

active

059045043

ABSTRACT:
Die attach methods are provided. These methods include (a) providing a supply of die attach adhesive, (b) applying a portion of the die attach adhesive to a transfer member, and (c) contacting the lead frame paddle with the transfer member to print a layer of adhesive onto the lead frame paddle. Integrated circuit (IC) devices are also provided.

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patent: 5151386 (1992-09-01), Bottari et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5226361 (1993-07-01), Grant et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5384286 (1995-01-01), Hirai
patent: 5423889 (1995-06-01), Colquitt et al.
patent: 5647122 (1997-07-01), Launay et al.
patent: 5739053 (1998-04-01), Kawakita et al.

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