Die/attach composition

Details Die/attach composition Die/attach composition

1985-09-16

1987-10-13

Dixon, Jr., William R.

Compositions: ceramic

Ceramic compositions

Glass compositions, compositions containing glass other than...

106114, 252514, C03C 818

Patent

active

046998888

ABSTRACT:
A silver-glass composition for use in attaching a semiconductor support and a method for making the attachment are disclosed. The glass component of the composition is a low melting point glass comprising about 75-85 wt. % lead oxide, about 8-15% boron oxide, about 0.75 to 2.5 wt. % silicon-dioxide, 0-10 wt. % zinc oxide, 0 to 3 wt. % alumina, 0.5 to 5.5 wt. % cuprousoxide and a non-volatile metal fluoride in amount such that the mol ratio of cuprous oxide to the fluoride content of the metal fluoride is in the range 1.0:0.25 to 1.0:10. The weight ratio of silver to glass in the composition is in the range about 2:1 to 9:1.

REFERENCES:
patent: 2530217 (1950-11-01), Bain
patent: 3154503 (1964-10-01), Janakirama-Rao et al.
patent: 4002799 (1977-01-01), Dumesnil et al.
patent: 4186023 (1980-01-01), Dumesnil et al.
patent: 4251595 (1981-02-01), Dumesnil et al.
patent: 4401767 (1983-08-01), Dietz et al.
patent: 4476090 (1984-10-01), Heidsiek et al.
Moghadam, F. K. "Development of Adhesive Die Attach Technology in Cerdip Packages; Material Issues"-Proceedings of the 1983 ISHM International Microelectronics Symposium, Oct. 31-Nov. 2, 1983, Phila., Pa.-9 pages.

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