Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – From carboxylic acid or derivative thereof
Patent
1996-07-17
1998-01-13
Dodson, Shelley A.
Synthetic resins or natural rubbers -- part of the class 520 ser
Synthetic resins
From carboxylic acid or derivative thereof
252572, 252514, 428208, 528 88, 528 92, 528 99, 528363, 528422, C08G 6344
Patent
active
057081298
ABSTRACT:
Described is a method of reducing resin bleed of a cyanate ester-containing die attach adhesive produced by curing a liquid resin system that contains cyanate ester monomer or mixtures that include cyanate ester monomer by adding an additive comprising at least one alkylene aromatic compound and curing the liquid resin system with the alkylene aromatic compound . Also disclosed is a die attach adhesive that comprises a resin system with an alkylene aromatic compound.
REFERENCES:
patent: 5150195 (1992-09-01), Nguyen
patent: 5155066 (1992-10-01), Nguyen
patent: 5195299 (1993-03-01), Nguyen
patent: 5250600 (1993-10-01), Nguyen et al.
patent: 5371178 (1994-12-01), Nguyen
patent: 5386000 (1995-01-01), Nguyen
patent: 5399907 (1995-03-01), Nguyen
J.E. Ireland, "Epoxy Bleedout in Ceramic Chip Carriers", Feb. 1982, International J. Hybrid.
M.L. White, "The Removal of Die Bond Epoxy Bleed material by Oxygen Plasma", 32nd ECC Conti May 10-12, 1982, San Diego, California, pp. 262-265.
M.R. Marks, et al., "An experimental study of die attach polymer bleedout in ceramic packages", (1994) Thin Solid Films vol. 252 (1994) pp. 54-60.
Michael R. Marks et al., "An Experimental Study of Die Attach Polymer Bleedout in Ceramic Packages", Thin Solid Films, 1994, pp. 54-60.
J.E. Ireland, "Epoxy Bleedout in Ceramic Chip Carriers", Feb. 1982, International J. Hybrid, 4 pages.
M.L. White, "The Removal of Die Bond Epoxy Bleed Material by Oxygen Plasma", 32nd ECC Conti May 10-12, 1982, San Diego, California, pp. 262-265.
P.G. de Gennes, "The Dynamic of Wetting", pp. 173-179.
"Describing the System", Discover, May 1994, pp. 2-1 to 2-5.
"Forcefields", Discover, May 1994, pp. 3-1 to 3-9.
Lieng-Huang Lee, "Roles of Molecular Interactions in Adhesion, Adsorption, Contact Angle and Wettability", presented to the American Chemical Society Symposium on Adhesion, Contact Angle and Wettability, San Francisco, California, Apr. 1992, pp. 583-634.
Le Kim-Chi
Nguyen My N.
Dodson Shelley A.
Johnson Matthey Inc.
LandOfFree
Die attach adhesive with reduced resin bleed does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Die attach adhesive with reduced resin bleed, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die attach adhesive with reduced resin bleed will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-327520