Die attach adhesive compositions

Details Die attach adhesive compositions Die attach adhesive compositions

1999-03-08

2000-11-14

Cain, Edward J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523177, 524440, 524441, C08K 300

Patent

active

061471410

ABSTRACT:
A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises

REFERENCES:
patent: 5912282 (1999-06-01), Iver et al.

Affiliated with

Also associated with

Rating

Die attach adhesive compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die attach adhesive compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die attach adhesive compositions will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2066029