Die attach adhesive compositions

Details Die attach adhesive compositions Die attach adhesive compositions

1998-01-13

1999-10-26

Cain, Edward J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524439, 524441, 523176, C08K 300

Patent

active

059730528

ABSTRACT:
A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises

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"Cleavable Epoxy Resins: Design for Disassembly of a Thermoset," by S.L. Buchwalter and L.L. Kosbar, Journal of Polymer Science: Part A: Polymer Chemistry, vol. 34, pp. 249-260 (1996).

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