Die attach adhesive compositions

Details Die attach adhesive compositions Die attach adhesive compositions

1996-12-16

1999-06-15

Cain, Edward J.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523177, C09J 400

Patent

active

059122820

ABSTRACT:
A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises

REFERENCES:
patent: 3979373 (1976-09-01), Kiovski et al.
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4826932 (1989-05-01), Wong
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5120678 (1992-06-01), Moore et al.
patent: 5274913 (1994-01-01), Grebe et al.
patent: 5288769 (1994-02-01), Papageorge et al.
patent: 5292688 (1994-03-01), Hsiao et al.
patent: 5360942 (1994-11-01), Hoffman et al.
patent: 5371328 (1994-12-01), Gutierrez et al.
patent: 5374701 (1994-12-01), Hay et al.
patent: 5390082 (1995-02-01), Chase et al.
patent: 5547149 (1996-08-01), Kalberer et al.
patent: 5641856 (1997-06-01), Meurs
International Search Report of May 22, 1998.
"Cleavable Epoxy Resins: Design for Disassembly of a Thermoset," by S. L. Buchwalter and L. L. Kosbar, Journal of PolymerScience: Part A: Polymer Chemistry, vol. 34, pp. 249-260 (1996).

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