Die attach adhesive composition

Details Die attach adhesive composition Die attach adhesive composition

1990-04-26

1991-04-09

Michl, Paul R.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

525930, 252514, C08L 6304

Patent

active

050065750

ABSTRACT:
A solid adhesive composition which is suitable for the very rapid attachment of IC chips to high surface energy substrates comprising flake silver particles dispersed in solid matrix consisting essentially of a thermoplastic phenoxy resin and a small amount of thermally crosslinkable resin.

REFERENCES:
patent: 4479983 (1984-10-01), Appelt et al.
patent: 4516836 (1985-05-01), Ferrato
patent: 4526912 (1985-07-01), Biorcio et al.
patent: 4587038 (1986-05-01), Tamura
patent: 4595606 (1986-06-01), St. John et al.
patent: 4732702 (1988-03-01), Yamazaki et al.
patent: 4880570 (1989-11-01), Sanborn et al.
patent: 4942190 (1990-07-01), Murayama et al.

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