Plastic article or earthenware shaping or treating: apparatus – Means providing a shaping orifice – Core – pin or insert member
Patent
1980-02-25
1981-08-04
Thurlow, Jeffery R.
Plastic article or earthenware shaping or treating: apparatus
Means providing a shaping orifice
Core, pin or insert member
264564, 2642091, 4251311, 4253261, 425376A, 425462, B29F 304, B29D 2304
Patent
active
042819814
ABSTRACT:
A die assembly of the present invention for extrudable materials includes a first member providing an external wall of a continuous cavity for passage of the extrudable material, a second member providing the internal wall of the cavity, a bushing for directing the flow of extrudable material within the cavity in one axial direction, a distributor interposed within the cavity, providing a restricted space therein for passage of the extrudable material, and a channel formed between the bushing and distributor through which the extrudable material flows axially and peripherally. The die assembly of the present invention can be modified for the coextrusion of two or more layers.
REFERENCES:
patent: 2943352 (1960-07-01), Van Riper
patent: 2957201 (1960-10-01), Fields et al.
patent: 2978748 (1961-04-01), McCauley et al.
patent: 3303247 (1967-02-01), Carter
patent: 3308509 (1967-03-01), Hsia
patent: 3323172 (1967-06-01), Pierson et al.
patent: 3546743 (1970-12-01), Roth
patent: 3895900 (1975-07-01), Harold et al.
patent: 4042661 (1977-08-01), Cook
patent: 4047868 (1977-09-01), Kudo et al.
patent: 4167383 (1979-09-01), Murakami et al.
Evans Larry W.
Knudsen Herbert D.
Standard Oil Company (Ohio)
Thurlow Jeffery R.
Untener David J.
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