Die assembly for molding optical disc substrates

Details Die assembly for molding optical disc substrates Die assembly for molding optical disc substrates

2006-05-30

2006-05-30

Heckenberg, Donald (Department: 1722)

Plastic article or earthenware shaping or treating: apparatus

Female mold and charger to supply fluent stock under...

C425S810000, C264S001330

Reexamination Certificate

active

07052269

ABSTRACT:
It is an object of the present invention to provide a die assembly for molding optical disc substrates, wherein formation of a burr perpendicular to a reading surface that is opposite to a signal surface of each optical disc substrate can be prevented and two signal surfaces can be bonded together satisfactorily. To that end, in a die assembly for molding optical disc substrates that comprises an outer circumferential stamper holder25having: a stamper holding portion34that holds an outer circumferential edge portion26E of a stamper26disposed on a specular plate24;and an inner circumferential portion33that defines an outer circumferential end27E of a molding cavity27,the inner circumferential portion33of the outer circumferential stamper holder is provided with a projecting portion35having an acute cross-section that consists of a smooth surface projecting into the molding cavity27toward the stamper holding portion34.

REFERENCES:
patent: 5180595 (1993-01-01), Kinoshita
patent: 5626890 (1997-05-01), Asai
patent: 08-132488 (1996-05-01), None
patent: 08-315430 (1996-11-01), None
patent: 2000-006170 (2000-11-01), None

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