Die assembly and method for manufacturing lamina stacks from...

Details Die assembly and method for manufacturing lamina stacks from... Die assembly and method for manufacturing lamina stacks from...

2004-10-06

2008-03-04

Hong, John C. (Department: 3726)

Metal working

Method of mechanical manufacture

Electrical device making

C029S779000

Reexamination Certificate

active

07337531

ABSTRACT:
A progressive die assembly and a method for manufacturing lamina stacks from a plurality of separate strips of stock material. The die assembly includes a plurality of feed pathways for the material strips, each feed pathway having an associated punch set. Each punch set includes one or more punches for stamping lamina features in the strip, as well as at least one blanking punch for blanking individual laminas from the strips. The die assembly additionally includes a choke assembly which is adapted to receive laminas which are blanked from each of the material strips by the blanking punches.

REFERENCES:
patent: 2260899 (1941-10-01), Heftler
patent: 4029252 (1977-06-01), Hawkins
patent: 4597168 (1986-07-01), Oboshi et al.
patent: 4619028 (1986-10-01), Neuenschwander
patent: 5241138 (1993-08-01), Neuenschwander
patent: 5349741 (1994-09-01), Neuenschwander
patent: 5406243 (1995-04-01), Jenkins et al.
patent: 5755023 (1998-05-01), Neuenschwander
patent: 5799387 (1998-09-01), Neuenschwander et al.
patent: 5881450 (1999-03-01), Neuenschwander
patent: 6163949 (2000-12-01), Neuenschwander
patent: 6192575 (2001-02-01), Neuenschwander

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