Die apparatus and method for high temperature forming of...

Details Die apparatus and method for high temperature forming of... Die apparatus and method for high temperature forming of...

2005-08-18

2008-10-14

Jones, David B (Department: 3725)

Metal deforming

By application of fluent medium, or energy field

Using fixed die

C072S413000, C029S421100

Reexamination Certificate

active

07434432

ABSTRACT:
A bi-material die apparatus for high temperature forming of metal parts has at least two opposing die segments having inner surfaces together forming a hollow mold chamber for receiving a mold blank between the die segments. The die segments are of a first material having a first coefficient of thermal expansion CTE1. At least one insert of a second material is associated with the inner surface of at least one of the die segments so as to project into the mold chamber, the second material having a second coefficient of thermal expansion CTE2higher than CTE1and higher than the coefficient of thermal expansion of the metal product to be formed in the cavity.

REFERENCES:
patent: 3934441 (1976-01-01), Hamilton et al.
patent: 4984348 (1991-01-01), Cadwell
patent: 5823034 (1998-10-01), Nelepovitz
patent: 5974847 (1999-11-01), Saunders et al.
patent: 6581428 (2003-06-01), Friedman
patent: 7100259 (2006-09-01), Morales et al.
patent: 7112249 (2006-09-01), Schroth et al.
patent: 2003/0209047 (2003-11-01), Nelepovitz
“Coefficients of Linear Expansion”, Jul. 6, 2007, The Engineering Tool Box, www. Engineeringtoolbox.com, pp. 1 and 2.

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