Die and wafer failure classification system and method

Details Die and wafer failure classification system and method Die and wafer failure classification system and method

2006-12-19

2008-08-19

Bui, Bryan (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system

Performance or efficiency evaluation

C702S182000, C702S185000

Reexamination Certificate

active

07415387

ABSTRACT:
A system and method for classifying failures of semiconductor integrated circuit dies using a unique input vector created from die level characterization data to classify wafer (process related) and die level (defect related) patterns. The failure classification may then be used to assign the appropriate yield loss by die. The classification results produced by the plurality of classifiers are examined with a preference towards assigning a wafer level failure classification to failure data for a die when any of the plurality of failure classification results indicates a presence of a wafer level failure.

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