Die and method of making the same

Details Die and method of making the same Die and method of making the same

1976-06-16

1977-10-11

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With cutting, punching, piercing, severing, or tearing

96 36, 156251, 156261, 156645, 156661, 156659, 156664, 156905, B32B 3100, C23F 102

Patent

active

040533484

ABSTRACT:
A high precision die particularly adapted to form from a relatively heavy foil sheet a circuit board where the individual circuit elements and the spacing thereof are of relatively small dimensions. The die is made as follows. A working surface of a die block is covered with a first protective overlay having an enlarged pattern corresponding to the pattern of the die elements to be formed, but enlarged by a substantially uniform width dimension. The surface is then exposed to an etching solution to remove material from the exposed areas. These two steps are repeated a second time with a pattern enlarged to a lesser degree, and again a third time to bring the die elements being formed from the die block within quite close tolerances to the original pattern. The die faces of the die elements are then etched to form knife edges on the die elements.

REFERENCES:
patent: 2321740 (1943-06-01), Flint
patent: 2753619 (1956-07-01), Franklin
patent: 3331726 (1967-07-01), McGinley et al.
patent: 3661577 (1972-05-01), Klemm et al.
patent: 3911716 (1975-10-01), Weglin

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