Die and method of making same

Details Die and method of making same Die and method of making same

1982-04-05

1984-05-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With cutting, punching, piercing, severing, or tearing

156251, 156651, 1566611, 156905, C23F 102, B44C 122, C03C 1500, C03C 2506

Patent

active

044472862

ABSTRACT:
A method for chemically milling an etchable workpiece by exposure thereof to an etchant in order to mill selected etchant-active areas and thereby form a plurality of raised die elements separated and bounded by a plurality of recessed cavities, which method is comprised of the steps of initially, partially etching the workpiece to form recessed die element precursors separated and bounded by recessed cavities, depositing a film of an etchant-resistant composition on the workpiece in at least selected ones of the recessed cavities, filling those selected cavities with an etchant-resistant filler and then subsequently processing the workpiece. In a highly preferred embodiment, the method comprises depositing a thin film of gold on the workpiece, removing the gold film from selected areas where active etching is to occur, and then filling the recessed cavities with an epoxy filler.

REFERENCES:
patent: 2624700 (1955-03-01), Morrison
patent: 4102735 (1978-07-01), Weglin

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