Die and method of making same

Chemistry: electrical and wave energy – Processes and products

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

83697, 156515, 156651, 1566611, 204 321, 204 381, C23F 102, B44C 122

Patent

active

045796343

ABSTRACT:
A method for chemically milling an etchable workpiece by exposure thereof to an etchant in order to mill selected etchant-active areas and thereby form a plurality of raised die elements separated and bounded by a plurality of recessed cavities is comprised of the steps of initially, partially etching the workpiece to form recessed die element precursors separated and bounded by recessed cavities, depositing a film of an etchant-resistant composition on the workpiece in at least selected ones of the recessed cavities, filling those selected cavities with an etchant-resistant filler and then subsequently processing the workpiece to form a die. The die is then completed by deposition of a film of a tribological composition, which may be the same as or different from the etchant-resistant composition, within those recessed cavities not theretofore bearing the etchant-resistant film.

REFERENCES:
patent: 3802078 (1974-04-01), Denes
patent: 3829969 (1974-08-01), Fischbein et al.
patent: 3911579 (1975-10-01), Lane et al.
patent: 4447286 (1984-05-01), Weglin
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 211-212, 269, 281-283.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Die and method of making same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die and method of making same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die and method of making same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1083266

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.