Die and method for applying radial forces to an eccentric workpi

Electric lamp or space discharge component or device manufacturi – Process – With assembly or disassembly

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

292835, 29516, 269156, H01J 918, B23Q 156, B23P 1100

Patent

active

056581815

ABSTRACT:
A die is disclosed for applying radial force to an eccentric workpiece. The die includes a set of faces that are each inclined from an orthogonal relationship with a different radial plane of the workpiece by an offset angle. The die also includes wedges that are positioned on the faces. They each have a jaw surface and a slide surface that are inclined from a parallel relationship with each other by a wedge angle that equals the offset angle of their respective face. The wedges can move over the faces to abut the workpiece along each of a plurality of transverse planes. In each of these planes, their movement can accommodate the workpiece's eccentricity in that plane. In addition, each jaw surface abuts the workpiece in a tangential relationship.

REFERENCES:
patent: 2586653 (1952-02-01), Hill
patent: 2822501 (1958-02-01), Poulter
patent: 3725992 (1973-04-01), Davis
patent: 4403385 (1983-09-01), Kirk
Hansen, James W., editor, TWT/TWTA Handbook, Hughes Aircraft Company, Electron Dynamics Division, Torrance, CA, pp. 46-55.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Die and method for applying radial forces to an eccentric workpi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Die and method for applying radial forces to an eccentric workpi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Die and method for applying radial forces to an eccentric workpi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1100691

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.