Die adhesion testing method and apparatus

Details Die adhesion testing method and apparatus Die adhesion testing method and apparatus

1992-07-09

1994-05-24

Myracle, Jerry W.

Measuring and testing

Specimen stress or strain, or testing by stress or strain...

By loading of specimen

73856, G01N 308

Patent

active

053138414

ABSTRACT:
A connector assembly for connecting to a chip and a substrate for testing the bond between a chip and a substrate in a testing apparatus, the connector assembly comprises a pair of connector blocks, each block having a generally square planar connecting face for bonding to oppositely directed faces of a chip and substrate, and a coupling end for mounting in a tensile testing machine, and a swivel connector assembly for connecting to the coupling and mounting in a tensile testing machine for the application of aligned tension to the chip and substrate.

REFERENCES:
patent: 3107524 (1963-10-01), O'Connor
patent: 4541287 (1985-09-01), Roper

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