Dicyclopentadiene polymers with heat-resistant dimensional integ

Stock material or miscellaneous articles – Composite – Of addition polymer from unsaturated monomers

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

428212, 526222, 526225, 526283, B32B 2728, B32B 2732

Patent

active

052682323

ABSTRACT:
A molded article comprising a cross-linked ring-opened polymer produced by the metathesis polymerization of a dicyclopentadiene (DCPD) monomer, which may be dicyclopentadiene (DCPD) or of a mixture of (DCPD) and norbornene group-containing cycloolefins, in the presence of an effective amount of a metathesis polymerization catalyst and a co catalyst that is capable of crosslinking the unsaturated double bonds of the polymer and thereby increasing the crosslink density of the polymer and its T.sub.g, a process for making it, a process for increasing the T.sub.g of the molded article, and uses of the molded article with a high T.sub.g.

REFERENCES:
patent: 4400340 (1983-08-01), Klosiewicz
patent: 4568660 (1986-02-01), Klosiewicz
patent: 4948856 (1990-08-01), Minchak et al.
patent: 5011730 (1991-04-01), Tenney et al.
patent: 5081208 (1992-01-01), Sjardijn
patent: 5093441 (1992-03-01), Sjardijn et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Dicyclopentadiene polymers with heat-resistant dimensional integ does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dicyclopentadiene polymers with heat-resistant dimensional integ, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dicyclopentadiene polymers with heat-resistant dimensional integ will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2014743

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.