Dicing tape and die attach adhesive with patterned backing

Details Dicing tape and die attach adhesive with patterned backing Dicing tape and die attach adhesive with patterned backing

2009-03-06

2010-12-28

Smith, Matthew S (Department: 2823)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C438S432000, C438S760000, C438S795000, C438S928000, C257S414000, C257SE21214, C257S079000

Reexamination Certificate

active

07858499

ABSTRACT:
Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.

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