Dicing tape and die attach adhesive with patterned backing

Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier

Reexamination Certificate

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Details

C438S432000, C438S760000, C438S795000, C438S928000, C257S414000, C257SE21214, C257S079000

Reexamination Certificate

active

07858499

ABSTRACT:
Provided are a tape, apparatus, and method that relate generally to a single layer adhesive which functions as a dicing tape and also as a die attach adhesive for dicing thinned wafers and subsequent die attach operations of the diced chips in semiconductor device fabrication. The tape, apparatus, and method include a backing with a surface modification that includes a pattern.

REFERENCES:
patent: 4308331 (1981-12-01), Narita et al.
patent: 4879430 (1989-11-01), Hoffman
patent: 5049085 (1991-09-01), Reylek et al.
patent: 5110388 (1992-05-01), Komiyama et al.
patent: 5118567 (1992-06-01), Komiyama et al.
patent: 5139804 (1992-08-01), Hoffman
patent: 5356949 (1994-10-01), Komiyama et al.
patent: 5525422 (1996-06-01), Spies et al.
patent: 5705016 (1998-01-01), Senoo et al.
patent: 5888606 (1999-03-01), Senoo et al.
patent: 7129150 (2006-10-01), Kawai
patent: 2002/0050061 (2002-05-01), Komyoji et al.
patent: 2002/0076848 (2002-06-01), Spooner et al.
patent: 2005/0031795 (2005-02-01), Chaudhury et al.
patent: 2006/0211220 (2006-09-01), Sakaya et al.
patent: 2007/0190318 (2007-08-01), Asai et al.
patent: 2008/0011415 (2008-01-01), Kiuchi et al.
patent: 08-053655 (1996-02-01), None
patent: 2004-349441 (2004-12-01), None
patent: 2006-104246 (2006-04-01), None
patent: WO 02/06413 (2002-01-01), None
U.S. Appl. No. 60/895,189, Eric G. Larson et al., filed Mar. 16, 2007.

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