Dicing tape

Details Dicing tape Dicing tape

2005-08-16

2005-08-16

Tran, Thao T. (Department: 1711)

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

C428S3550EP, C428S3550RA, C428S447000

Reexamination Certificate

active

06929856

ABSTRACT:
Dicing tape comprises a tackifiable adhesive layer which is composed mainly of a polyimide and has a peel strength of 0.02 N/mm (20 gf/cm) or greater as the adhesive strength at near room temperature (20-50° C.) and a cured peel strength of 0.3 N/mm (300 gf/cm) or greater. The tape exhibits adhesive strength with silicon wafers sufficiently high to allow dicing at near room temperature, and also exhibits high adhesive strength with circuit boards after curing, in light of the processing disadvantages of polyimide-based dicing tape resulting from its low tacky strength (initial adhesive strength) at low temperatures of around room temperature, which requires a higher ambient temperature to increase the adhesive force and thus necessitates supplementary heating equipment.

REFERENCES:
patent: 5180627 (1993-01-01), Inoue et al.
patent: 6271107 (2001-08-01), Massingill et al.
patent: 6335571 (2002-01-01), Capote et al.
patent: 05025452 (1993-02-01), None
patent: 05025453 (1993-02-01), None
patent: 10324857 (1998-12-01), None

Affiliated with

Also associated with

Rating

Dicing tape does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Dicing tape, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Dicing tape will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3473884