Dicing sheet, manufacturing method thereof, and...

Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier

Reexamination Certificate

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Details

C438S460000, C257S782000, C257S787000

Reexamination Certificate

active

11159047

ABSTRACT:
A dicing sheet which supports electronic-component aggregation with adhesive in the case of separating the electronic-component aggregation in which a plurality of electronic components are integrated, has a substrate and an adhesion layer which is formed at one surface side of the substrate, in which a concave portion is formed on a surface of the adhesion layer, and the concave portion is formed so that a convex shape member projected from an adhesion surface of the electronic-component aggregation which is adhered to the dicing sheet is inserted.

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patent: 2004-050305 (2004-02-01), None

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