Dicing sheet, manufacturing method thereof, and...

Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier

Reexamination Certificate

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Details

C438S460000, C257S782000, C257S787000

Reexamination Certificate

active

07402503

ABSTRACT:
A dicing sheet which supports electronic-component aggregation with adhesive in the case of separating the electronic-component aggregation in which a plurality of electronic components are integrated, has a substrate and an adhesion layer which is formed at one surface side of the substrate, in which a concave portion is formed on a surface of the adhesion layer, and the concave portion is formed so that a convex shape member projected from an adhesion surface of the electronic-component aggregation which is adhered to the dicing sheet is inserted.

REFERENCES:
patent: 5989982 (1999-11-01), Yoshikazu
patent: 6171163 (2001-01-01), Seko et al.
patent: 6184064 (2001-02-01), Jiang et al.
patent: 6462415 (2002-10-01), Ishiguri et al.
patent: 6972204 (2005-12-01), Oohata et al.
patent: 2004/0038498 (2004-02-01), Ozono et al.
patent: 61-180442 (1986-08-01), None
patent: 63-029948 (1988-02-01), None
patent: 08-069983 (1996-03-01), None
patent: 11-111162 (1999-04-01), None
patent: 2001-196404 (2001-07-01), None
patent: 2004-050305 (2004-02-01), None

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