Dicing saw alignment for array ultrasonic transducer fabrication

Details Dicing saw alignment for array ultrasonic transducer fabrication Dicing saw alignment for array ultrasonic transducer fabrication

1995-12-11

1998-03-24

Smith, James G.

Stone working

Sawing

Rotary

29 2535, 29600, B28D 104

Patent

active

057301131

ABSTRACT:
An array ultrasonic transducer precursor includes a body of piezoelectric material with a dielectric substrate bonded to a surface of the body. Circuit elements supported on the dielectric substrate include, in an active region, physically parallel signal conductors arranged in a pattern with spaces between adjacent ones of the conductors. Dicing saw cuts made in these spaces define individual circuit elements within the piezoelectric body. The circuit elements outside the active region include a set of resistive alignment elements in predetermined positions with reference to the pattern of signal conductors. The transducer precursor is mounted in a dicing saw fixture, and initial cuts made with the dicing saw remove portions of the resistive alignment elements. Locations of the initial cuts with reference to the resistive alignment elements are determined by measuring resistances of the resistive alignment elements after the initial cuts.

REFERENCES:
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patent: 4869768 (1989-09-01), Zola
patent: 5091893 (1992-02-01), Smith et al.
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patent: 5423220 (1995-06-01), Finsterwald et al.
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patent: 5548564 (1996-08-01), Smith
patent: 5637800 (1997-06-01), Finsterwald et al.
Product Brochure ASK 77.5.3000, "DAD-2H/5 Disco Automatic Dicing Saw", Disco Abrasive Systems, Inc., Mountain View, CA.

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