Dicing saw alignment for array ultrasonic transducer fabrication

Details Dicing saw alignment for array ultrasonic transducer fabrication Dicing saw alignment for array ultrasonic transducer fabrication

1997-09-26

1999-02-02

Eley, Timothy V.

Stone working

Sawing

Reciprocating

125 1301, 29 2535, B28D 106

Patent

active

058651632

ABSTRACT:
An array ultrasonic transducer precursor includes a body of piezoelectric material with a dielectric substrate bonded to a surface of the body. Circuit elements supported on the dielectric substrate include, in an active region, physically parallel signal conductors arranged in a pattern with spaces between adjacent ones of the conductors. Dicing saw cuts made in these spaces define individual circuit elements within the piezoelectric body. The circuit elements outside the active region include a set of resistive alignment elements in predetermined positions with reference to the pattern of signal conductors. The transducer precursor is mounted in a dicing saw fixture, and initial cuts made with the dicing saw remove portions of the resistive alignment elements. Locations of the initial cuts with reference to the resistive alignment elements are determined by measuring resistances of the resistive alignment elements after the initial cuts.

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